Hardware-minimal arm-current stress test for double half-bridge submodules in modular multilevel converters

The double submodule (DSM), which integrates two series-connected half-bridges within a single submodule, has gained attention as a compact and space-efficient building block for the modular multilevel converters (MMCs) used in constrained environments such as urban power-conversion stations and electric ship propulsion systems. Reliable DSM operation must be verified under realistic loading conditions. However, existing submodule (SM) test approaches, including mission profile emulations (MPEs) and power-hardware-in-the-loop simulations (PHILS), are unsuitable for DSMs. When applied to DSMs, these approaches require a high-voltage power amplifier with an output capability exceeding twice the dc rating of an equivalent single SM, which significantly increases implementation complexity. This paper proposes a DSM-based loading-test method that eliminates the need for an auxiliary high-volt…