| 2022 | Actual Maximum Junction Temperature Estimation Process of Multichip SiC MOSFET Power Modules With New Calibration Method and Deep Learning IEEE Journal of Emerging and Selected Topics in Power Electronics | 윤상원 | 31 |
| 2017 | Miniature Piezoelectric Sensor for In-Situ Temperature Monitoring of Silicon and Silicon Carbide Power Modules Operating at High Temperature IEEE Transactions on Industry Applications | 윤상원 | 26 |
| 2020 | Thermal Impedance Characterization Using Optical Measurement Assisted by Multi-Physics Simulation for Multi-Chip SiC MOSFET Module 중전기기 › 발전기/전동기 및 제어 Micromachines | 윤상원 | 18 |
| 2019 | DBC-Packaged Inverter Power Module for Integrated Motor-Inverter Design Used in 48 V Mild Hybrid Starter-Generator (MHSG) System IEEE Transactions on Vehicular Technology | 윤상원 | 15 |
| 2021 | Design and Experimental Evaluation of Transfer-Molded 650 V Super-Junction mosfet Power Module for Industrial Applications 중전기기 › 발전기/전동기 및 제어 IEEE Transactions on Industry Applications | 윤상원 | 13 |
| 2018 | Optimal Design of Three-Dimensional Heat Flow Structures for Power Electronics Applications Journal of Thermal Science and Engineering Applications | 신종원 | 12 |
| 2019 | Multiphysics Simulation Analysis and Design of Integrated Inverter Power Module for Electric Compressor Used in 48-V Mild Hybrid Vehicles IEEE Journal of Emerging and Selected Topics in Power Electronics | 윤상원 | 11 |
| 2021 | Iterative Electrical–Thermal Coupled Simulation Method of Automotive Power Module Used in Electric Power Steering System 중전기기 › 발전기/전동기 및 제어 IEEE Access | 윤상원 | 10 |
| 2024 | Noise-Robust Online Measurement of the On-State Resistance of the Power Semiconductor Devices in PWM Converters IEEE Access | 신종원 | 4 |
| 2025 | Thermal Behavior in Vertically Stacked Cascode GaN HEMT Power Modules Including Mutual Heating, Dissipation Disturbance, and Solder Voids IEEE Transactions on Components Packaging and Manufacturing Technology | 윤상원 | 1 |
| 2025 | Balanced Vertical Structures for Thermal Expansion Matching and Reduced Thermomechanical Stress in Silicon Carbide Double-Sided Cooling Power Modules IEEE Transactions on Components Packaging and Manufacturing Technology | 윤상원 | 1 |
| 2026 | Improving Electrical and Thermal Performance of 650-V GaN E-HEMT Modules Using a Cover-All Meandered Thick-Copper (CAMT) Interconnection IEEE Access | 윤상원 | 0 |
| 2026 | Embedded PCB and DBC-integrated design of 650 V GaN power modules with enhanced thermal and electrical performance Microelectronics Reliability | 윤상원 | 0 |
| 2026 | Modeling and Improvement of Heat-Flow Paths Inside 3D-nand First-Level Packages With Internal Metal Structures IEEE Transactions on Electron Devices | 윤상원 | 0 |