DBC Switch Module for Management of Temperature and Noise in 220-W/in3 Power Assembly

A switch module integrates semiconductor dies on a direct-bond-copper (DBC) substrate to achieve both noise robustness and low thermal resistance. Negative couplings between conductors as well as compact layout with 2.89-nH common-source inductance in the module eliminate self-turn-on from 420-A/μs di/dt . The low thermal resistance of the DBC substrate provides 2.35-°C/W thermal resistance from junction to heat sink and limits the temperature rise of semiconductors switches to 50 °C. The maximum rated power and system density of the DBC and PCB modules are provided for 400-V application. A 2-kW dc-dc boost converter switched between 400 kHz and 1 MHz achieved a power density of 220 W/in3and an efficiency of 98.4% by employing the switch module.