Finite Element and Experimental Analysis of Spacer Designs for Reducing the Thermomechanical Stress in Double-Sided Cooling Power Modules
2020 · IEEE Journal of Emerging and Selected Topics in Power Electronics
저자
Jae-Jin Jeon, Jihwan Seong, Jangmuk Lim, Min Ki Kim, Taehwa Kim, Sang Won Yoon
연구주제
Silicon Carbide Semiconductor Technologies · Heat Transfer and Optimization
NTIS 과학기술표준분류
에너지/자원만에너지·환경·원자력 확장
지원 과제·AI 키워드로 잡을 근거가 없어 분류하지 않았다.
AI 연구 키워드·방법
차량용 전력 모듈 양면 냉각 전력 모듈 metal spacer design solder joint reliability thermo mechanical stress
키워드 (OpenAlex)
thermo-mechanical stress solder joint reliability automotive power electronics spacer geometry thermal cycling thermal resistance electrified vehicles
초록
This article addresses the role of metal spacer design in reducing the thermomechanical stress of solder joint in automotive double-sided cooling power electronics modules. The performance and reliability of power modules are becoming increasingly important in electrified vehicles. A double-sided cooling structure has dual heat sinks placed on the top and bottom of the module and is the most promising solution for improving the thermal reliability of power modules. One of the unique components of this structure is its metal spacers, which are responsible for both electrical and thermal conductions via the connecting embedded power semiconductor dies and their top-side substrates. Reported spacers are typically cuboid in shape, providing a relatively large solder-contact area with the power dies. This large contact area is beneficial in reducing the electrical and thermal resistances, but…
이 논문을 지원한 국가R&D 과제 (NTIS 성과)
| 연도 | 과제 | 부처 | 사업 | 수행기관 | NTIS 분류(1순위) |
|---|---|---|---|---|---|
| 2021 | 미래자동차-소프트웨어 융복합 혁신인재 양성 교육연구단 | 교육부 | 4단계두뇌한국21사업(R&D) | 한양대학 | – |
인접 그래프
노드 hover = 이웃 강조 · 1회 클릭 = 고정 · 고정된 노드 다시 클릭 = 페이지 이동